Camemake
CameVision Ego Single Sensor · 1 IMU
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Mono layout

Mechanical and thermal

One module, one IMU, RV1126B in the centre.

The two faces

Camera side. One SC233HGS module. Centre square: RV1126B. Support the PCB outline, never the barrel.
Connector side. USB-C, PH, RST, BOOT, UART. Centre via field is the back-side thermal landing under the RV1126B.

Where the heat is

Thermal path: RV1126B. One ISP and the NPU. The camera, eMMC and VS6621 stay clear of that path.

ZoneOn the PCBIn the housing
SoC lidCentre square, camera sidePrimary cool point. Soft pad onto a metal wall or small heatsink.
SoC via fieldCentre of the connector sideSecondary cool point. Isolating gap pad into the same metal.
CameraOne barrelOptical keep-out. Never clamp or twist the module.
Wi-Fi / antennasRF squarePlastic or air. Metal here kills range and does not cool the SoC.

One camera draws less than Ego’s dual ISP. Still design the lid pad for the NPU-on band in still air.

Cooling is part of the housing

1. Pick up the lid A 1–2 mm isolating silicone gap pad on the RV1126B lid, compressed 10–30 % onto aluminium or steel.
2. Use the via field A second pad on the connector-side via field, into the same metal.
3. Hold the board, not the barrel Bosses or a pocket under the outline. The camera floats in its hole.
4. Leave service faces USB-C, BOOT, RST and PH stay reachable. Maskrom: hold BOOT, tap RST.
NPU offNPU on
Die in still 25 °C air35–42 °C40–45 °C
Practical part50 × 50 mm, 12 mm fins60 × 60 mm, 15–18 mm fins, or one housing wall
Kernel trip115 °C · cpu-thermal

Assembly

1

Board

  1. Handle the outline, not the barrel and not the SoC lid.
  2. Seat the MIPI / module connector fully. A half-click gives 0 fps and CSI errors.
2

Thermal parts

  1. Lid pad on the RV1126B square only.
  2. Back pad on the via field only. Stay off USB-C, PH, RST, BOOT.
3

Housing

  1. Lower the board onto the bosses. The camera enters its hole last, with no side load.
  2. Close the lid so the SoC pad compresses. Check that BOOT and RST still click.

Keep-outs

FeatureWhy
Camera barrelOptical axis. A clamp here can crack the module.
Module connectorMechanical seating. Loose flex = no MIPI frames.
BOOT / RST / RX / TXMaskrom and console.
PHBattery lead. Strain-relieve in the shell.
RF squareWi-Fi / BT. Metal here is a shield, not a cooler.
adb shell cat /sys/class/thermal/thermal_zone0/temp

Millidegrees C. Operating 35000–45000. Critical 115000.